Architecting the AI Era: Samsung Electronics and NVIDIA Define the Future at GTC 2026

Samsung Electronics, a global leader in advanced semiconductor technology, took center stage at NVIDIA GTC 2026 to showcase its vision for the future of artificial intelligence (AI). Samsung demonstrated its commitment to powering AI factories and breakthroughs in AI infrastructure through comprehensive solutions spanning memory, logic, foundry, and advanced packaging, as showcased at the company’s GTC 2026 booth (#1207). At this year’s GTC, Samsung unveiled its HBM4E chip and HBM5 architecture for the first time and showcased a comprehensive suite of “Total AI Solution”, further solidifying its ‘AI partnership” with NVIDIA.

Pioneering the Next-Generation AI as a Leading Partner

The event’s momentum peaked during NVIDIA CEO Jensen Huang’s keynote. Huang specifically singled out Samsung as a key partner in manufacturing the new Language Processing Unit(LPU) for Groq. Combined with the mention of Samsung’s support for high-performance memory solutions for the Vera Rubin platform, this acknowledgement indicates that Samsung and NVIDIA have expanded their collaboration across multiple business sectors.

Unrivaled Technical Leadership: HBM4E & HBM5

At the heart of the Samsung booth, the industry’s first commercially mass-produced HBM4 and the world’s first revealed HBM4E wafer drew significant attention from global media and tech influencers.

• Performance: The 6th-generation HBM4 achieves industry-leading speeds of up to 13Gbps per pin.
• Innovation: Samsung showcased its next-generation HCB (Hybrid Copper Bonding) packaging technology, which improves thermal resistance by 20%, ensuring stability in high-performance computing environments.

SangJoon Hwang, EVP of Memory Product & Technology at Samsung Electronics, presented Samsung’s strategic vision for future technology directions, which included plans for HBM5. Samsung plans to apply the same core die and base die structure used in previous model(HBM4E), while enhancing the individual components of HBM5. Specifically, the core die will utilize the sixth-generation 10nm-class(1c) DRAM process, and the base die will be manufactured using a 2-nanometer foundry process.

The Industry’s Only “Total AI Solution”

Samsung’s presence at GTC 2026 was not limited to memory alone. In the NVIDIA Gallery, Samsung demonstrated its unique capability as the only provider capable of offering a “Total AI Solution”—spanning Memory, Foundry, and Packaging. Key demonstrations included:

• SOCAMM2 specifically optimized for Vera CPUs.
• PM1763 SSD, a PCIe 6.0-based storage solution providing the data throughput required for massive AI training.

Beyond Hardware: A Vision for Agentic AI

Executive Vice President Yong-Ho Song shared Samsung’s broader vision during his session on “Agentic AI”. He emphasized that the partnership with NVIDIA now extends beyond product supply into the realm of manufacturing innovation, including AI Factories and Digital Twin technology.

The event concluded on a high note with a surprise visit from Jensen Huang to the Samsung booth. Interacting with employees in front of the “HBM4 Hero Wall” and signing products, Huang’s visit symbolized the deepening synergy between the two giants as they together “Architect AI Systems” for the future.