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		<title>EUV라인 - 삼성전자 반도체 뉴스룸</title>
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            <title>EUV라인 - 삼성전자 반도체 뉴스룸</title>
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				<title>[카드뉴스] 5나노의 벽을 넘은 EUV 기반 초미세 파운드리 공정 기술 리더십</title>
				<link>https://news.samsungsemiconductor.com/kr/%ec%b9%b4%eb%93%9c%eb%89%b4%ec%8a%a4-5%eb%82%98%eb%85%b8%ec%9d%98-%eb%b2%bd%ec%9d%84-%eb%84%98%ec%9d%80-euv-%ea%b8%b0%eb%b0%98-%ec%b4%88%eb%af%b8%ec%84%b8-%ed%8c%8c%ec%9a%b4%eb%93%9c%eb%a6%ac/?utm_source=rss&amp;utm_medium=direct</link>
				<pubDate>Tue, 16 Apr 2019 09:00:00 +0000</pubDate>
				<dc:creator><![CDATA[삼성전자 반도체]]></dc:creator>
						<category><![CDATA[기술]]></category>
		<category><![CDATA[반도체+]]></category>
		<category><![CDATA[EUV라인]]></category>
		<category><![CDATA[삼성반도체]]></category>
		<category><![CDATA[삼성전자]]></category>
		<category><![CDATA[초미세공정]]></category>
		<category><![CDATA[카드뉴스]]></category>
									<description><![CDATA[<p>[카드뉴스] 5나노의 벽을 넘은 EUV 기반 초미세 파운드리 공정 기술 리더십 삼성전자는 지난해 화성캠퍼스에 EUV(Extreme Ultraviolet, 극자외선) 라인을 건설을 시작하며 최첨단 반도체 미세공정 기술 리더십 확보에 나섰는데요. 7나노부터 최근 개발이 완료된 5나노...</p>
<p>The post <a href="https://news.samsungsemiconductor.com/kr/%ec%b9%b4%eb%93%9c%eb%89%b4%ec%8a%a4-5%eb%82%98%eb%85%b8%ec%9d%98-%eb%b2%bd%ec%9d%84-%eb%84%98%ec%9d%80-euv-%ea%b8%b0%eb%b0%98-%ec%b4%88%eb%af%b8%ec%84%b8-%ed%8c%8c%ec%9a%b4%eb%93%9c%eb%a6%ac/">[카드뉴스] 5나노의 벽을 넘은 EUV 기반 초미세 파운드리 공정 기술 리더십</a> first appeared on <a href="https://news.samsungsemiconductor.com/kr">삼성전자 반도체 뉴스룸</a>.</p>]]></description>
																<content:encoded><![CDATA[<p>[카드뉴스] 5나노의 벽을 넘은 EUV 기반 초미세 파운드리 공정 기술 리더십</p>



<p>삼성전자는 지난해 화성캠퍼스에 EUV(Extreme Ultraviolet, 극자외선) 라인을 건설을 시작하며 최첨단 반도체 미세공정 기술 리더십 확보에 나섰는데요.</p>



<p>7나노부터 최근 개발이 완료된 5나노 공정까지, EUV 노광 기술을 적용한 초미세 파운드리 공정 성과를 카드뉴스로 확인하세요.</p>



<div class="wp-block-image"><figure class="aligncenter size-full"><img fetchpriority="high" decoding="async" width="1200" height="800" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_01-1.jpg" alt="EUV1" class="wp-image-2610" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_01-1.jpg 1200w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_01-1-300x200.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_01-1-1024x683.jpg 1024w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_01-1-768x512.jpg 768w" sizes="(max-width: 1200px) 100vw, 1200px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img decoding="async" width="1000" height="1000" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_02.jpg" alt="EUV2" class="wp-image-2611" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_02.jpg 1000w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_02-300x300.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_02-768x768.jpg 768w" sizes="(max-width: 1000px) 100vw, 1000px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img decoding="async" width="1125" height="1125" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_03.png" alt="EUV3" class="wp-image-2612" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_03.png 1125w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_03-300x300.png 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_03-1024x1024.png 1024w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_03-768x768.png 768w" sizes="(max-width: 1125px) 100vw, 1125px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img loading="lazy" decoding="async" width="1000" height="1000" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_04.jpg" alt="EUV4" class="wp-image-2613" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_04.jpg 1000w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_04-300x300.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_04-768x768.jpg 768w" sizes="auto, (max-width: 1000px) 100vw, 1000px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img loading="lazy" decoding="async" width="1000" height="1000" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_05.jpg" alt="EUV5" class="wp-image-2614" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_05.jpg 1000w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_05-300x300.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_05-768x768.jpg 768w" sizes="auto, (max-width: 1000px) 100vw, 1000px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img loading="lazy" decoding="async" width="1000" height="1000" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_06.jpg" alt="EUV6" class="wp-image-2615" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_06.jpg 1000w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_06-300x300.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_06-768x768.jpg 768w" sizes="auto, (max-width: 1000px) 100vw, 1000px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img loading="lazy" decoding="async" width="1000" height="1000" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_07.jpg" alt="EUV7" class="wp-image-2616" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_07.jpg 1000w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_07-300x300.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_07-768x768.jpg 768w" sizes="auto, (max-width: 1000px) 100vw, 1000px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img loading="lazy" decoding="async" width="1000" height="1000" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_08.jpg" alt="EUV8" class="wp-image-2617" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_08.jpg 1000w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_08-300x300.jpg 300w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/05/euv_photo_190416_08-768x768.jpg 768w" sizes="auto, (max-width: 1000px) 100vw, 1000px" /></figure></div>



<p class="has-medium-font-size"><strong><span class="has-inline-color has-vivid-cyan-blue-color">관련 콘텐츠 보러가기</span></strong></p>



<p><a rel="noreferrer noopener" href="https://bit.ly/3vzyih3" data-type="URL" data-id="https://bit.ly/3vzyih3" target="_blank">삼성전자, 최첨단 5나노 파운드리 공정 개발</a></p><p>The post <a href="https://news.samsungsemiconductor.com/kr/%ec%b9%b4%eb%93%9c%eb%89%b4%ec%8a%a4-5%eb%82%98%eb%85%b8%ec%9d%98-%eb%b2%bd%ec%9d%84-%eb%84%98%ec%9d%80-euv-%ea%b8%b0%eb%b0%98-%ec%b4%88%eb%af%b8%ec%84%b8-%ed%8c%8c%ec%9a%b4%eb%93%9c%eb%a6%ac/">[카드뉴스] 5나노의 벽을 넘은 EUV 기반 초미세 파운드리 공정 기술 리더십</a> first appeared on <a href="https://news.samsungsemiconductor.com/kr">삼성전자 반도체 뉴스룸</a>.</p>]]></content:encoded>
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