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		<title>리드프레임 - 삼성전자 반도체 뉴스룸</title>
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            <title>리드프레임 - 삼성전자 반도체 뉴스룸</title>
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				<title>[반도체 용어 사전] 리드 프레임</title>
				<link>https://news.samsungsemiconductor.com/kr/%eb%b0%98%eb%8f%84%ec%b2%b4-%ec%9a%a9%ec%96%b4-%ec%82%ac%ec%a0%84-%eb%a6%ac%eb%93%9c-%ed%94%84%eb%a0%88%ec%9e%84/?utm_source=rss&amp;utm_medium=direct</link>
				<pubDate>Fri, 16 Aug 2013 09:00:00 +0000</pubDate>
				<dc:creator><![CDATA[삼성전자 반도체]]></dc:creator>
						<category><![CDATA[기술]]></category>
		<category><![CDATA[용어사전]]></category>
		<category><![CDATA[lead frame]]></category>
		<category><![CDATA[리드프레임]]></category>
		<category><![CDATA[삼성반도체]]></category>
		<category><![CDATA[삼성전자]]></category>
									<description><![CDATA[<p>반도체 칩과 외부 회로를 연결하는 전선(lead)과 반도체 패키지를 기판에 고정시키는 버팀대(frame) 역할을 하는 금속기판. 반도체 집적회로를 구성하는 핵심부품으로, 가는 전선(lead)으로 칩과 연결되어 반도체 칩과 기판 사이에 전기신호를 전달하고, 외부의 습기나 충격...</p>
<p>The post <a href="https://news.samsungsemiconductor.com/kr/%eb%b0%98%eb%8f%84%ec%b2%b4-%ec%9a%a9%ec%96%b4-%ec%82%ac%ec%a0%84-%eb%a6%ac%eb%93%9c-%ed%94%84%eb%a0%88%ec%9e%84/">[반도체 용어 사전] 리드 프레임</a> first appeared on <a href="https://news.samsungsemiconductor.com/kr">삼성전자 반도체 뉴스룸</a>.</p>]]></description>
																<content:encoded><![CDATA[<div class="wp-block-image"><figure class="aligncenter size-full"><img fetchpriority="high" decoding="async" width="700" height="274" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_1.jpg" alt="[반도체 용어 사전] 리드 프레임" class="wp-image-7887" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_1.jpg 700w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_1-300x117.jpg 300w" sizes="(max-width: 700px) 100vw, 700px" /></figure></div>



<p><a href="https://bit.ly/3w3A620" data-type="URL" data-id="https://bit.ly/3w3A620" target="_blank" rel="noreferrer noopener">반도체</a> 칩과 외부 회로를 연결하는 전선(lead)과 반도체 패키지를 기판에 고정시키는 버팀대(frame) 역할을 하는 금속기판.</p>



<p>반도체 <a href="https://bit.ly/3cFVG55" data-type="URL" data-id="https://bit.ly/3cFVG55" target="_blank" rel="noreferrer noopener">집적회로</a>를 구성하는 핵심부품으로, 가는 전선(lead)으로 칩과 연결되어 반도체 칩과 기판 사이에 전기신호를 전달하고, 외부의 습기나 충격 등으로부터 칩을 보호 및 지지하는 골격 역할을 한다.</p>



<div class="wp-block-image"><figure class="aligncenter size-full"><img decoding="async" width="700" height="396" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_2.jpg" alt="리드 프레임" class="wp-image-7893" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_2.jpg 700w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_2-300x170.jpg 300w" sizes="(max-width: 700px) 100vw, 700px" /></figure></div>



<div class="wp-block-image"><figure class="aligncenter size-full"><img decoding="async" width="700" height="100" src="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_3-1.jpg" alt="추천" class="wp-image-7896" srcset="https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_3-1.jpg 700w, https://news.samsungsemiconductor.com/kr/wp-content/uploads/2021/06/443_words_20130816_3-1-300x43.jpg 300w" sizes="(max-width: 700px) 100vw, 700px" /></figure></div><p>The post <a href="https://news.samsungsemiconductor.com/kr/%eb%b0%98%eb%8f%84%ec%b2%b4-%ec%9a%a9%ec%96%b4-%ec%82%ac%ec%a0%84-%eb%a6%ac%eb%93%9c-%ed%94%84%eb%a0%88%ec%9e%84/">[반도체 용어 사전] 리드 프레임</a> first appeared on <a href="https://news.samsungsemiconductor.com/kr">삼성전자 반도체 뉴스룸</a>.</p>]]></content:encoded>
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